writer：Bingfei Nan，Yingjie Zhan，Chang-an Xu
keywords：Heat dissipation; nanodiamond; thermal conductivity; electrical insulation; thermal management applications
source：期刊
specific source：POLYMER-PLASTICS TECHNOLOGY AND MATERIALS
Issue time：2022年

Carbon-based nanomaterials have mighty prospects in thermal conductive applications. In the past few decades, graphene and its derivatives have been shown to be very effective in heat dissipation capability and there are many reviews of these. Diamond, particular nanodiamond nanoparticles (ND NPs) with 5–10 nm, as another important carbon allotrope, which has the advantages of high hardness, chemical stability, good biocompatibility, excellent thermal conductivity (κ) and electrical insulation, and exhibits potential application prospects in the thermal conductive field. This review summarizes and discusses the functionalization, filler hybridization of ND NPs, the interfacial interactions between ND NPs and polymer matrix, the synergy effect of different dimensional fillers and ND NPs, as well as the ND-based composites for thermal management applications in the recent years.