writer：X. H. Zhang*, L. H. Huang, S. Chen, G. R. Qi
keywords：thermosetting resins, thermal stability, flame retardancy, epoxy, bisphenol
source：期刊
specific source：eXPRESS Polymer Letters Vol.1, No.5 (2007) 326–332
Issue time：2007年
A novel bisphenol 1, 4’-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine. The curing behavior of DGEBA/diamine changed dramatically due to the introduction of BHPB. The resultant epoxy thermosets containing BHPB had high Tgs (127–160°C), high Td,5% (≥ 330°C) and high integral procedure decomposition temperature (IPDT) values (662–1230°C) and good flame retardancy because of their high Limiting Oxygen Index (LOI) value (above 29.5).