writer：Zhong Chen, Wei Wang, Brian Cotterell, Ewald Guenther, Soo-Jin Chua
keywords：Flexible devices; Indium tin oxide; Interfaces; Optoelectronic devices
source：期刊
specific source：Thin Solid Films
Issue time：2001年

This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability.