Joint-Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy
作者：Z. Xie, Z. Dou, D. Wu, X. Zeng, Y. Feng, Y. Tian, Q. Fu*, K. Wu*
关键字：Thermal interface material
论文来源：期刊
发表时间：2023年
Advanced Functional Materials
