[Composites Part B]Nest-like hetero-structured BNNS@SiCnws fillers and significant improvement on thermal conductivities of epoxy composites
作者:Yixin Han, Xuetao Shi*, Shuangshuang Wang, Kunpeng Ruan, Chuyao Lu, Yongqiang Guo and Junwei Gu*
关键字:Thermally conductive composites
论文来源:期刊
具体来源:Composites Part B-Engineering
发表时间:2021年
AbstractSilicon carbide nanowires (SiCnws) were in-situ grown on boron nitride nanosheets (BNNS) to construct a novel kind of nest-like hetero-structured BNNS@SiCnws thermally conductive fillers from natural bamboo leaves and tetraethyl orthosilicate (TEOS) by means of ultrasonic impregnation, sol-gel followed by carbothermic reduction. Then, the thermally conductive & electrically insulating BNNS@SiCnws/epoxy composites were prepared via blending-casting method. When the amount of BNNS@SiCnws-II (65/35, wt/wt) was 20 wt%, BNNS@SiCnws/epoxy composites presented the optimal overall performances. Thermal conductivity coefficient (λ) of BNNS@SiCnws-II (20 wt%) /epoxy composites increased from 0.22 W/mK of pure epoxy matrix to 1.17 W/mK, higher than that of SiCnws/epoxy (0.72 W/mK), BNNS/epoxy (0.82 W/mK) and (BNNS/SiCnws)/epoxy composites (direct mixing BNNS/SiCnws, 65/35, wt/wt 0.76 W/mK) with the same filler concentration of 20 wt%. Meanwhile, BNNS@SiCnws/epoxy composites presented excellent heat transfer/heat dissipation efficiency, due to synergistic effect of the “line-to-surface” hetero-structure of SiCnws and BNNS, which could significantly improve the formation probability of the thermally conductive paths. Furthermore, the BNNS@SiCnws/epoxy composites possessed favorable electrical insulation, thermostability and ideal mechanical properties. Furthermore, the related surface & volume resistivities, the electric breakdown strength, the glass-transition temperature, the heat resistant index, the flexural strength as well as the impact strength of BNNS@SiCnws-II (20 wt%)/epoxy composites reached to be 3.7×1015 Ω, 5.17×1015 Ω·cm, 22.1 kV/mm, 126.7 oC, 185.5 oC, 75.7 MPa and 8.2 kJ/m2, respectively.
本文以天然竹叶为生物质碳源结合正硅酸乙酯(TEOS,硅源),通过超声浸渍-溶胶凝胶-碳热还原法在氮化硼纳米片(BNNS)上原位生长碳化硅纳米线(SiCnws)构筑制备“鸟巢状”异质结构BNNS@SiCnws导热绝缘填料,进而与环氧树脂基体共混复合-浇注成型制备BNNS@SiCnws/环氧树脂导热绝缘复合材料。结果表明,当BNNS@SiCnws-II质量分数为20 wt%时,BNNS@SiCnws-II/环氧树脂导热绝缘复合材料具有最佳的综合性能。其热导率(λ)从纯环氧树脂的0.22 W/mK提升到1.17 W/mK,均高于相同质量分数(20 wt%)的SiCnws/epoxy(单一SiCnws,0.72 W/mK)、BNNS/epoxy(单一BNNS,0.82 W/mK)和(SiCnws/BNNS)/epoxy(直接共混复合SiCnws和BNNS,0.76 W/mK)导热绝缘复合材料的热导率,且具有优越的传热/散热效能,主要归因于BNNS@SiCnws-II能充分发挥SiCnws和BNNS“线-面”异质结构的协同作用,显著提升导热通路的形成概率。此时BNNS@SiCnws-II/环氧树脂导热绝缘复合材料具有优异的电绝缘性能、热稳定性以及理想的力学性能,其表面电阻率(ρs)、体积电阻率(ρv)、电击穿强度(Eb)、玻璃化转变温度(Tg)、耐热指数(THRI)、弯曲强度和冲击强度分别为3.7×1015 Ω、5.17×1015 Ω·cm、22.1 kV/mm、126.7oC、185.5oC、75.7 MPa和8.2 kJ/m2。