Yixin Han, Kunpeng Ruan and Junwei Gu*. Multifunctional Thermally Conductive Composite Films Based on Fungal Tree-like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers. Angewandte Chemie International Edition, 2023, 135(5): e202216093. 2021IF=16.823.（1区化学Top期刊）

https://doi.org/10.1002/anie.202216093

Abstract

Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, “solvothermal & in-situ growth” method is carried out to prepare “Fungal tree”-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of “suction filtration self-assembly and hot-pressing”. When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m·K) and excellent tensile strength of 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.

通过“溶剂热法-原位生长法”制备出“真菌树”状银纳米线@氮化硼纳米片（AgNWs@BNNS）异质结构导热填料，再与化学解离制备的芳纶纳米纤维（ANF）复合，经“抽滤自组装-热压”法制备出AgNWs@BNNS/ANF导热复合膜。当AgNWs@BNNS的质量分数为50 wt%时，AgNWs@BNNS/ANF导热复合膜具有优异的导热性能（导热系数为9.44 W/(m·K)）和拉伸强度（136.6 MPa）、良好的温度-电压响应特性（低供电电压下的高焦耳加热温度（5 V、240.6 ℃）以及快速响应时间（10 s））、优异的电稳定性和可靠性（1000次、6000 s拉伸-弯曲疲劳工作下稳定和恒定的实时电阻）。

本文亮点

1. 通过“溶剂热法-原位生长法”制备出“真菌树”状银纳米线@氮化硼纳米片（AgNWs@BNNS）异质结构导热填料。

2. AgNWs@BNNS/ANF导热复合膜兼具高达9.44 W/(m·K)的面内热导率以及优异的拉伸强度（136.6 MPa）。

3. AgNWs@BNNS/ANF导热复合膜具有良好的温度-电压响应特性（如低供电电压下的高焦耳加热温度（5 V、240.6℃）以及快速响应时间（10 s））。

4. AgNWs@BNNS/ANF导热复合膜具有优异的电稳定性和可靠性（1000次、6000 s拉伸-弯曲疲劳工作下稳定和恒定的实时相对电阻）。